Atc4 real8/2/2023 ![]() 006” diameter thru holes and metallized with 500Å WTi, under minimum 2.0-3.0μm (80-120μ”) thin film more » deposited Au. ![]() The selected assembly consists of a procured 1x12 Vertical Cavity Surface Emitting Laser (VCSEL) die, having 80um diameter eutectic AuSn solder bumps at 250um pitch and flip chip bonded to a. This paper explores the development of an optical flip chip application and details the selection/qualification of the substrate. ![]() = ,Īs military electronics tend to become lighter, smaller, thinner, and lower cost, the use of flip chip technology is becoming more common place to meet system requirements, yet survive environments.
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